Webinars and workshops

ZeroAMP Final Workshop – Logic,Memory, Sensors and More for Harsh Environments

29 October 2023
IEEE Sensors 2023, Vienna, Austria

Download the presentation slides

Workshop "Electronics for extreme environments"

30 June 2022
Clifton Hill House, Bristol, UK

watch the presentations

ZeroAMP Project – NEMS Switch Devices and Packaging for Harsh Environments by Piers Tremlett, Microchip Technology Inc

12 January 2022
IMAPS-UK webinar

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Scientific publications

Worsey, E., Tang, Q., Krishnan, M. B., Kumar Kulsreshath, M. & Pamunuwa, D.

Nanoelectromechanical analog-to-digital converter for low power and harsh environments.

in 2024 IEEE International Symposium on Circuits and Systems (ISCAS) 1–5 (IEEE, 2024). doi: 10.1109/ISCAS58744.2024.10558630. Archive: Explore Bristol Research

Worsey, E.

Nanoelectromechanical technology for radiation and temperature harsh environments.

(university of Bristol, 2024). Archive: Explore Bristol Research

Kulsreshath, M. K., Tang, Q., Worsey, E., Krishanan, M. B., Li, Y., Bleiker, S. J., Niklaus, F. & Pamunuwa, D.

Digital Nanoelectromechanical Non-Volatile Memory Cell.

IEEE Electron Device Letters 45, 728–731 (2024). doi: 10.1109/LED.2024.3362956. Archive: Explore Bristol Research

Li, Y., Worsey, E., Bleiker, S. J., Edinger, P., Kulsreshath, M. K., Tang, Q., Takabayashi, A. Y., Quack, N., Verheyen, P., Bogaerts, W., Gylfason, K. B., Pamunuwa, D. & Niklaus, F.

Integrated 4-terminal single-contact nanoelectromechanical relays implemented in a silicon-on-insulator foundry process.

Nanoscale 10.1039.D3NR03429A (2023). doi: 10.1039/D3NR03429A. Archive: DIVA

Li, Y., Bleiker, S. J., Edinger, P., Worsey, E., Kumar Kulsreshath, A., Tang, Q., Yuji Takabayashi, A., Quack, N., Verheyen, P., Bogaerts, W., Gylfason, K. B., Pamunuwa, D. & Niklaus, F.

Design and Fabrication of a 4-Terminal In-Plane Nanoelectromechanical Relay.

in IEEE Transducers 2023 Conference on Solid-State Sensors, Actuators and Microsystems (2023). Archive: DIVA

Worsey, E., Kulsreshath, M. K., Tang, Q. & Pamunuwa, D.

Fully Microelectromechanical Non-Volatile Memory Cell.

in 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) 507–510 (IEEE, 2023). doi: 10.1109/MEMS49605.2023.10052290. Archive: Explore Bristol Research

Jo, G., Edinger, P., Bleiker, S. J., Wang, X., Yuji Takabayashi, A., Sattari, H., Quack, N., Jezzini, M., Su Lee, J., Kumar Malik, A., Verheyen, P., Zand, I., Khan, U., Bogaerts, W., Stemme, G., Gylfason, K. B. & Niklaus, F.

Wafer-level Hermetic Sealing of Silicon Photonic MEMS by Direct Metal-to-Metal Bonding.

in WaferBond’22 Conference of Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (2022). Archive: DIVA

Reynolds, J. D., Rana, S., Worsey, E., Tang, Q., Kulsreshath, M. K., Chong, H. M. H. & Pamunuwa, D.

Single‐Contact, Four‐Terminal Microelectromechanical Relay for Efficient Digital Logic.

Advanced Electronic Materials 2200584 (2022). doi: 10.1002/aelm.202200584. Archive: Explore Bristol Research

Ku, B., van de Wetering, F., Bolten, J., Stel, B., van de Kerkhof, M. A. & Lemme, M. C.

AFM‐Based Hamaker Constant Determination with Blind Tip Reconstruction.

Advanced Materials Technologies 2200411 (2022). doi: 10.1002/admt.202200411. Archive: arXiv

10.

Jo, G., Edinger, P., Bleiker, S. J., Wang, X., Takabayashi, A. Y., Sattari, H., Quack, N., Jezzini, M., Lee, J. S., Verheyen, P., Zand, I., Khan, U., Bogaerts, W., Stemme, G., Gylfason, K. B. & Niklaus, F.

Wafer-level hermetically sealed silicon photonic MEMS.

Photonics Research 10, A14 (2022). doi: 10.1364/PRJ.441215. Archive: DIVA

11.

Pamunuwa, D., Worsey, E., Reynolds, J. D., Seward, D., Chong, H. M. H. & Rana, S.

Theory, Design, and Characterization of Nanoelectromechanical Relays for Stiction-Based Non-Volatile Memory.

Journal of Microelectromechanical Systems 1–9 (2022). doi: 10.1109/JMEMS.2021.3138022. Archive: Explore Bristol Research

12.

Jo, G., Edinger, P., Bleiker, S., Wang, X., Takabayashi, A. Y., Sattari, H., Quack, N., Jezzini de Anda, M. A., Verheyen, P., Stemme, G., Bogaerts, W., Gylfason, K. B. & Niklaus, F.

Wafer-level vacuum sealing for packaging of silicon photonic MEMS.

in Silicon Photonics XVI (eds. Reed, G. T. & Knights, A. P.) 11 (SPIE, 2021). doi: 10.1117/12.2582975. Archive: DIVA