Webinars and workshops

ZeroAMP Final Workshop – Logic,Memory, Sensors and More for Harsh Environments

  • 29 October 2023
  • IEEE Sensors 2023, Vienna, Austria
Download the presentation slides

Workshop "Electronics for extreme environments"

  • 30 June 2022
  • Clifton Hill House, Bristol, UK
watch the presentations

ZeroAMP Project – NEMS Switch Devices and Packaging for Harsh Environments by Piers Tremlett, Microchip Technology Inc

  • 12 January 2022
  • IMAPS-UK webinar
Download the presentation slides
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Scientific publications

1.
Li, Y.
Integrated 4-terminal single-contact nanoelectromechanical relays implemented in a silicon-on-insulator foundry process.
Nanoscale 10.1039.D3NR03429A (2023). doi: 10.1039/D3NR03429A. Archive: DIVA
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2.
Li, Y.
Design and Fabrication of a 4-Terminal In-Plane Nanoelectromechanical Relay.
in IEEE Transducers 2023 Conference on Solid-State Sensors, Actuators and Microsystems (2023). Archive: DIVA
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3.
Worsey, E., Kulsreshath, M. K., Tang, Q. & Pamunuwa, D.
Fully Microelectromechanical Non-Volatile Memory Cell.
in 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) 507–510 (IEEE, 2023). doi: 10.1109/MEMS49605.2023.10052290. Archive: Explore Bristol Research
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4.
Jo, G.
Wafer-level Hermetic Sealing of Silicon Photonic MEMS by Direct Metal-to-Metal Bonding.
in WaferBond’22 Conference of Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (2022). Archive: DIVA
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5.
Reynolds, J. D.
Single‐Contact, Four‐Terminal Microelectromechanical Relay for Efficient Digital Logic.
Advanced Electronic Materials 2200584 (2022). doi: 10.1002/aelm.202200584. Archive: Explore Bristol Research
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6.
Ku, B.
AFM‐Based Hamaker Constant Determination with Blind Tip Reconstruction.
Advanced Materials Technologies 2200411 (2022). doi: 10.1002/admt.202200411. Archive: arXiv
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7.
Jo, G.
Wafer-level hermetically sealed silicon photonic MEMS.
Photonics Research 10, A14 (2022). doi: 10.1364/PRJ.441215. Archive: DIVA
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8.
Pamunuwa, D.
Theory, Design, and Characterization of Nanoelectromechanical Relays for Stiction-Based Non-Volatile Memory.
Journal of Microelectromechanical Systems 1–9 (2022). doi: 10.1109/JMEMS.2021.3138022. Archive: Explore Bristol Research
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9.
Jo, G.
Wafer-level vacuum sealing for packaging of silicon photonic MEMS.
in Silicon Photonics XVI (eds. Reed, G. T. & Knights, A. P.) 11 (SPIE, 2021). doi: 10.1117/12.2582975. Archive: DIVA
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zotero
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Participation at scientific events

CW ITP Conference 27-28 October 2021, Nice, France - invited talk by Dinesh Pamunuwa (UNIVBRIS) on relay-based non-volatile memory

Wednesday, October 27, 2021

CW ITP Conference 27-28 October 2021, Nice, France - invited talk by Dinesh Pamunuwa (UNIVBRIS) on relay-based non-volatile memory

Link to the event LinkedIn post

Publishable summary

ZeroAMP produces annual publishable reports which describe the project achievements. They are public and the latest one can be downloaded by clicking on the link below.
First publishable summary

Project Video

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A video presentation of the ZeroAMP project has been produced by SCIPROM at the beginning of the project. A very special thanks to ZeroAMP coordinator Piers Tramlett for a beautiful voiceover.

Project Flyer

Our flyer is a concise presentation of our overall project structure and goals. It is printer-friendly and can be easily read on a mobile device.
Download the flyer
This project has received funding from the European Union's Horizon 2020 research and innovation programme under grant agreement No 871740 (ZeroAMP).
© 2020 ZeroAMP Project
Created by SCIPROM