TY - CONF TI - Design and Fabrication of a 4-Terminal In-Plane Nanoelectromechanical Relay AU - Li, Yingying AU - Bleiker, Simon J. AU - Edinger, Pierre AU - Worsey, Elliott AU - Kumar Kulsreshath, Alain AU - Tang, Qi AU - Yuji Takabayashi, Alain AU - Quack, Niels AU - Verheyen, Peter AU - Bogaerts, Wim AU - Gylfason, Kristinn B. AU - Pamunuwa, Dinesh AU - Niklaus, Frank T2 - IEEE Transducers 2023 Conference on Solid-State Sensors, Actuators and Microsystems C3 - IEEE Transducers 2023 Conference on Solid-State Sensors, Actuators and Microsystems DA - 2023/06/29/ PY - 2023 AN - https://www.diva-portal.org/smash/record.jsf?dswid=-1530&pid=diva2%3A1810149&c=6&searchType=SIMPLE&language=en&query=yingying+li&af=%5B%22contentTypeCode%3Arefereed%22%5D&aq=%5B%5B%5D%5D&aq2=%5B%5B%5D%5D&aqe=%5B%5D&noOfRows=50&sortOrder=author_sort_asc&sortOrder2=title_sort_asc&onlyFullText=false&sf=all DB - DIVA ER - TY - JOUR TI - Integrated 4-terminal single-contact nanoelectromechanical relays implemented in a silicon-on-insulator foundry process AU - Li, Yingying AU - Worsey, Elliott AU - Bleiker, Simon J. AU - Edinger, Pierre AU - Kulsreshath, Mukesh Kumar AU - Tang, Qi AU - Takabayashi, Alain Yuji AU - Quack, Niels AU - Verheyen, Peter AU - Bogaerts, Wim AU - Gylfason, Kristinn B. AU - Pamunuwa, Dinesh AU - Niklaus, Frank T2 - Nanoscale AB - Silicon 4-T NEM relays, patterned in front-end-of-line processing and monolithically integrated with back-end-of-line metallic interconnects manufactured in a commercial foundry platform. , Integrated nanoelectromechanical (NEM) relays can be used instead of transistors to implement ultra-low power logic circuits, due to their abrupt turn off characteristics and zero off-state leakage. Further, realizing circuits with 4-terminal (4-T) NEM relays enables significant reduction in circuit device count compared to conventional transistor circuits. For practical 4-T NEM circuits, however, the relays need to be miniaturized and integrated with high-density back-end-of-line (BEOL) interconnects, which is challenging and has not been realized to date. Here, we present electrostatically actuated silicon 4-T NEM relays that are integrated with multi-layer BEOL metal interconnects, implemented using a commercial silicon-on-insulator (SOI) foundry process. We demonstrate 4-T switching and the use of body-biasing to reduce pull-in voltage of a relay with a 300 nm airgap, from 15.8 V to 7.8 V, consistent with predictions of the finite-element model. Our 4-T NEM relay technology enables new possibilities for realizing NEM-based circuits for applications demanding harsh environment computation and zero standby power, in industries such as automotive, Internet-of-Things, and aerospace. DA - 2023/10/12/ PY - 2023 DO - 10.1039/D3NR03429A DP - DOI.org (Crossref) SP - 10.1039.D3NR03429A J2 - Nanoscale LA - en SN - 2040-3364, 2040-3372 UR - http://xlink.rsc.org/?DOI=D3NR03429A AN - https://www.diva-portal.org/smash/record.jsf?dswid=-1530&pid=diva2%3A1810174&c=4&searchType=SIMPLE&language=en&query=yingying+li&af=%5B%22contentTypeCode%3Arefereed%22%5D&aq=%5B%5B%5D%5D&aq2=%5B%5B%5D%5D&aqe=%5B%5D&noOfRows=50&sortOrder=author_sort_asc&sortOrder2=title_sort_asc&onlyFullText=false&sf=all DB - DIVA Y2 - 2023/10/23/13:49:24 ER - TY - CONF TI - Fully Microelectromechanical Non-Volatile Memory Cell AU - Worsey, Elliott AU - Kulsreshath, Mukesh K. AU - Tang, Qi AU - Pamunuwa, Dinesh T2 - 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) C1 - Munich, Germany C3 - 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) DA - 2023/01/15/ PY - 2023 DO - 10.1109/MEMS49605.2023.10052290 DP - DOI.org (Crossref) SP - 507 EP - 510 PB - IEEE SN - 978-1-66549-308-6 UR - https://ieeexplore.ieee.org/document/10052290/ AN - https://research-information.bris.ac.uk/en/publications/fully-microelectromechanical-non-volatile-memory-cell DB - Explore Bristol Research Y2 - 2023/04/04/09:40:20 ER - TY - CONF TI - Wafer-level Hermetic Sealing of Silicon Photonic MEMS by Direct Metal-to-Metal Bonding AU - Jo, Gaehun AU - Edinger, Pierre AU - Bleiker, Simon J. AU - Wang, Xiaojing AU - Yuji Takabayashi, Alain AU - Sattari, Hamed AU - Quack, Niels AU - Jezzini, Moises AU - Su Lee, Jun AU - Kumar Malik, Arun AU - Verheyen, Peter AU - Zand, Iman AU - Khan, Umar AU - Bogaerts, Wim AU - Stemme, Göran AU - Gylfason, Kristinn B. AU - Niklaus, Frank T2 - WaferBond’22 Conference of Wafer Bonding for Microsystems, 3D- and Wafer Level Integration AB - The field of silicon (Si) photonic micro-electromechanical system (MEMS) for photonic integrated circuits (PICs) has evolved rapidly. Thanks to the ultra-low power consumption of Si photonic MEMS, it enables a wide range of high-performance photonic devices such as integrated optical MEMS phase shifters, tunable couplers and switches. However, photonic MEMS have suspended and movable parts which need to be protected from environmental influences, such as exposure to dust and humidity. Therefore, a packaging solution is needed for reliable operation over long periods. Here, we demonstrate wafer-level vacuum sealing of Si photonic MEMS inside cavities with ultra-thin Si caps. C3 - WaferBond’22 Conference of Wafer Bonding for Microsystems, 3D- and Wafer Level Integration DA - 2022/11/30/ PY - 2022 AN - http://kth.diva-portal.org/smash/record.jsf?pid=diva2%3A1714873&dswid=-8825 DB - DIVA ER - TY - JOUR TI - Single‐Contact, Four‐Terminal Microelectromechanical Relay for Efficient Digital Logic AU - Reynolds, James D. AU - Rana, Sunil AU - Worsey, Elliott AU - Tang, Qi AU - Kulsreshath, Mukesh K. AU - Chong, Harold M. H. AU - Pamunuwa, Dinesh T2 - Advanced Electronic Materials DA - 2022/09/06/ PY - 2022 DO - 10.1002/aelm.202200584 DP - DOI.org (Crossref) SP - 2200584 J2 - Adv Elect Materials LA - en SN - 2199-160X, 2199-160X UR - https://onlinelibrary.wiley.com/doi/10.1002/aelm.202200584 AN - https://research-information.bris.ac.uk/en/publications/single-contact-four-terminal-microelectromechanical-relay-for-eff DB - Explore Bristol Research Y2 - 2022/09/28/07:45:43 ER - TY - JOUR TI - AFM‐Based Hamaker Constant Determination with Blind Tip Reconstruction AU - Ku, Benny AU - van de Wetering, Ferdinandus AU - Bolten, Jens AU - Stel, Bart AU - van de Kerkhof, Mark A. AU - Lemme, Max C. T2 - Advanced Materials Technologies DA - 2022/08/11/ PY - 2022 DO - 10.1002/admt.202200411 DP - DOI.org (Crossref) SP - 2200411 J2 - Adv Materials Technologies LA - en SN - 2365-709X, 2365-709X UR - https://onlinelibrary.wiley.com/doi/10.1002/admt.202200411 AN - https://arxiv.org/abs/2208.06822 DB - arXiv Y2 - 2022/08/17/14:18:56 ER - TY - JOUR TI - Wafer-level hermetically sealed silicon photonic MEMS AU - Jo, Gaehun AU - Edinger, Pierre AU - Bleiker, Simon J. AU - Wang, Xiaojing AU - Takabayashi, Alain Yuji AU - Sattari, Hamed AU - Quack, Niels AU - Jezzini, Moises AU - Lee, Jun Su AU - Verheyen, Peter AU - Zand, Iman AU - Khan, Umar AU - Bogaerts, Wim AU - Stemme, Göran AU - Gylfason, Kristinn B. AU - Niklaus, Frank T2 - Photonics Research DA - 2022/02/01/ PY - 2022 DO - 10.1364/PRJ.441215 DP - DOI.org (Crossref) VL - 10 IS - 2 SP - A14 J2 - Photon. Res. LA - en SN - 2327-9125 UR - http://opg.optica.org/abstract.cfm?URI=prj-10-2-A14 AN - http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-308964 DB - DIVA Y2 - 2022/01/19/14:08:17 ER - TY - JOUR TI - Theory, Design, and Characterization of Nanoelectromechanical Relays for Stiction-Based Non-Volatile Memory AU - Pamunuwa, Dinesh AU - Worsey, Elliott AU - Reynolds, Jamie D. AU - Seward, Derek AU - Chong, Harold M. H. AU - Rana, Sunil T2 - Journal of Microelectromechanical Systems DA - 2022/// PY - 2022 DO - 10.1109/JMEMS.2021.3138022 DP - DOI.org (Crossref) SP - 1 EP - 9 J2 - J. Microelectromech. Syst. SN - 1057-7157, 1941-0158 UR - https://ieeexplore.ieee.org/document/9669034/ AN - https://research-information.bris.ac.uk/en/publications/theory-design-and-characterisation-of-nanoelectromechanical-relay DB - Explore Bristol Research Y2 - 2022/01/07/08:56:46 ER - TY - CONF TI - Wafer-level vacuum sealing for packaging of silicon photonic MEMS AU - Jo, Gaehun AU - Edinger, Pierre AU - Bleiker, Simon AU - Wang, Xiaojing AU - Takabayashi, Alain Y. AU - Sattari, Hamed AU - Quack, Niels AU - Jezzini de Anda, Moises A. AU - Verheyen, Peter AU - Stemme, Göran AU - Bogaerts, Wim AU - Gylfason, Kristinn B. AU - Niklaus, Frank T2 - Silicon Photonics XVI A2 - Reed, Graham T. A2 - Knights, Andrew P. C1 - Online Only, United States C3 - Silicon Photonics XVI DA - 2021/03/05/ PY - 2021 DO - 10.1117/12.2582975 DP - DOI.org (Crossref) SP - 11 PB - SPIE SN - 978-1-5106-4217-1 978-1-5106-4218-8 UR - https://www.spiedigitallibrary.org/conference-proceedings-of-spie/11691/2582975/Wafer-level-vacuum-sealing-for-packaging-of-silicon-photonic-MEMS/10.1117/12.2582975.full AN - http://kth.diva-portal.org/smash/record.jsf?pid=diva2%3A1542824&dswid=-9605 DB - DIVA Y2 - 2021/05/05/09:58:24 ER -