%0 Conference Paper %T Design and Fabrication of a 4-Terminal In-Plane Nanoelectromechanical Relay %W https://www.diva-portal.org/smash/record.jsf?dswid=-1530&pid=diva2%3A1810149&c=6&searchType=SIMPLE&language=en&query=yingying+li&af=%5B%22contentTypeCode%3Arefereed%22%5D&aq=%5B%5B%5D%5D&aq2=%5B%5B%5D%5D&aqe=%5B%5D&noOfRows=50&sortOrder=author_sort_asc&sortOrder2=title_sort_asc&onlyFullText=false&sf=all %B IEEE Transducers 2023 Conference on Solid-State Sensors, Actuators and Microsystems %A Li, Yingying %A Bleiker, Simon J. %A Edinger, Pierre %A Worsey, Elliott %A Kumar Kulsreshath, Alain %A Tang, Qi %A Yuji Takabayashi, Alain %A Quack, Niels %A Verheyen, Peter %A Bogaerts, Wim %A Gylfason, Kristinn B. %A Pamunuwa, Dinesh %A Niklaus, Frank %D 2023-06-29 %0 Journal Article %T Integrated 4-terminal single-contact nanoelectromechanical relays implemented in a silicon-on-insulator foundry process %P 10.1039.D3NR03429A %W https://www.diva-portal.org/smash/record.jsf?dswid=-1530&pid=diva2%3A1810174&c=4&searchType=SIMPLE&language=en&query=yingying+li&af=%5B%22contentTypeCode%3Arefereed%22%5D&aq=%5B%5B%5D%5D&aq2=%5B%5B%5D%5D&aqe=%5B%5D&noOfRows=50&sortOrder=author_sort_asc&sortOrder2=title_sort_asc&onlyFullText=false&sf=all %U http://xlink.rsc.org/?DOI=D3NR03429A %X Silicon 4-T NEM relays, patterned in front-end-of-line processing and monolithically integrated with back-end-of-line metallic interconnects manufactured in a commercial foundry platform. , Integrated nanoelectromechanical (NEM) relays can be used instead of transistors to implement ultra-low power logic circuits, due to their abrupt turn off characteristics and zero off-state leakage. Further, realizing circuits with 4-terminal (4-T) NEM relays enables significant reduction in circuit device count compared to conventional transistor circuits. For practical 4-T NEM circuits, however, the relays need to be miniaturized and integrated with high-density back-end-of-line (BEOL) interconnects, which is challenging and has not been realized to date. Here, we present electrostatically actuated silicon 4-T NEM relays that are integrated with multi-layer BEOL metal interconnects, implemented using a commercial silicon-on-insulator (SOI) foundry process. We demonstrate 4-T switching and the use of body-biasing to reduce pull-in voltage of a relay with a 300 nm airgap, from 15.8 V to 7.8 V, consistent with predictions of the finite-element model. Our 4-T NEM relay technology enables new possibilities for realizing NEM-based circuits for applications demanding harsh environment computation and zero standby power, in industries such as automotive, Internet-of-Things, and aerospace. %G en %J Nanoscale %A Li, Yingying %A Worsey, Elliott %A Bleiker, Simon J. %A Edinger, Pierre %A Kulsreshath, Mukesh Kumar %A Tang, Qi %A Takabayashi, Alain Yuji %A Quack, Niels %A Verheyen, Peter %A Bogaerts, Wim %A Gylfason, Kristinn B. %A Pamunuwa, Dinesh %A Niklaus, Frank %D 2023-10-12 %0 Conference Paper %T Fully Microelectromechanical Non-Volatile Memory Cell %C Munich, Germany %I IEEE %P 507-510 %W https://research-information.bris.ac.uk/en/publications/fully-microelectromechanical-non-volatile-memory-cell %@ 978-1-66549-308-6 %U https://ieeexplore.ieee.org/document/10052290/ %B 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) %A Worsey, Elliott %A Kulsreshath, Mukesh K. %A Tang, Qi %A Pamunuwa, Dinesh %D 2023-01-15 %0 Conference Paper %T Wafer-level Hermetic Sealing of Silicon Photonic MEMS by Direct Metal-to-Metal Bonding %W http://kth.diva-portal.org/smash/record.jsf?pid=diva2%3A1714873&dswid=-8825 %X The field of silicon (Si) photonic micro-electromechanical system (MEMS) for photonic integrated circuits (PICs) has evolved rapidly. Thanks to the ultra-low power consumption of Si photonic MEMS, it enables a wide range of high-performance photonic devices such as integrated optical MEMS phase shifters, tunable couplers and switches. However, photonic MEMS have suspended and movable parts which need to be protected from environmental influences, such as exposure to dust and humidity. Therefore, a packaging solution is needed for reliable operation over long periods. Here, we demonstrate wafer-level vacuum sealing of Si photonic MEMS inside cavities with ultra-thin Si caps. %B WaferBond’22 Conference of Wafer Bonding for Microsystems, 3D- and Wafer Level Integration %A Jo, Gaehun %A Edinger, Pierre %A Bleiker, Simon J. %A Wang, Xiaojing %A Yuji Takabayashi, Alain %A Sattari, Hamed %A Quack, Niels %A Jezzini, Moises %A Su Lee, Jun %A Kumar Malik, Arun %A Verheyen, Peter %A Zand, Iman %A Khan, Umar %A Bogaerts, Wim %A Stemme, Göran %A Gylfason, Kristinn B. %A Niklaus, Frank %D 2022-11-30 %0 Journal Article %T Single‐Contact, Four‐Terminal Microelectromechanical Relay for Efficient Digital Logic %P 2200584 %W https://research-information.bris.ac.uk/en/publications/single-contact-four-terminal-microelectromechanical-relay-for-eff %U https://onlinelibrary.wiley.com/doi/10.1002/aelm.202200584 %G en %J Advanced Electronic Materials %A Reynolds, James D. %A Rana, Sunil %A Worsey, Elliott %A Tang, Qi %A Kulsreshath, Mukesh K. %A Chong, Harold M. H. %A Pamunuwa, Dinesh %D 2022-09-06 %0 Journal Article %T AFM‐Based Hamaker Constant Determination with Blind Tip Reconstruction %P 2200411 %W https://arxiv.org/abs/2208.06822 %U https://onlinelibrary.wiley.com/doi/10.1002/admt.202200411 %G en %J Advanced Materials Technologies %A Ku, Benny %A van de Wetering, Ferdinandus %A Bolten, Jens %A Stel, Bart %A van de Kerkhof, Mark A. %A Lemme, Max C. %D 2022-08-11 %0 Journal Article %T Wafer-level hermetically sealed silicon photonic MEMS %V 10 %N 2 %P A14 %W http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-308964 %U http://opg.optica.org/abstract.cfm?URI=prj-10-2-A14 %G en %J Photonics Research %A Jo, Gaehun %A Edinger, Pierre %A Bleiker, Simon J. %A Wang, Xiaojing %A Takabayashi, Alain Yuji %A Sattari, Hamed %A Quack, Niels %A Jezzini, Moises %A Lee, Jun Su %A Verheyen, Peter %A Zand, Iman %A Khan, Umar %A Bogaerts, Wim %A Stemme, Göran %A Gylfason, Kristinn B. %A Niklaus, Frank %D 2022-02-01 %0 Journal Article %T Theory, Design, and Characterization of Nanoelectromechanical Relays for Stiction-Based Non-Volatile Memory %P 1-9 %W https://research-information.bris.ac.uk/en/publications/theory-design-and-characterisation-of-nanoelectromechanical-relay %U https://ieeexplore.ieee.org/document/9669034/ %J Journal of Microelectromechanical Systems %A Pamunuwa, Dinesh %A Worsey, Elliott %A Reynolds, Jamie D. %A Seward, Derek %A Chong, Harold M. H. %A Rana, Sunil %D 2022 %0 Conference Paper %T Wafer-level vacuum sealing for packaging of silicon photonic MEMS %C Online Only, United States %I SPIE %P 11 %W http://kth.diva-portal.org/smash/record.jsf?pid=diva2%3A1542824&dswid=-9605 %@ 978-1-5106-4217-1 978-1-5106-4218-8 %U https://www.spiedigitallibrary.org/conference-proceedings-of-spie/11691/2582975/Wafer-level-vacuum-sealing-for-packaging-of-silicon-photonic-MEMS/10.1117/12.2582975.full %B Silicon Photonics XVI %A Jo, Gaehun %A Edinger, Pierre %A Bleiker, Simon %A Wang, Xiaojing %A Takabayashi, Alain Y. %A Sattari, Hamed %A Quack, Niels %A Jezzini de Anda, Moises A. %A Verheyen, Peter %A Stemme, Göran %A Bogaerts, Wim %A Gylfason, Kristinn B. %A Niklaus, Frank %E Reed, Graham T. %E Knights, Andrew P. %D 2021-3-5