Webinars and workshops

Workshop "Electronics for extreme environments"

30 June 2022
Clifton Hill House, Bristol, UK

watch the presentations

ZeroAMP Project – NEMS Switch Devices and Packaging for Harsh Environments by Piers Tremlett, Microchip Technology Inc

12 January 2022
IMAPS-UK webinar

Download the presentation slides

Scientific publications

Worsey, E., Kulsreshath, M. K., Tang, Q. & Pamunuwa, D.

Fully Microelectromechanical Non-Volatile Memory Cell.

in 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) 507–510 (IEEE, 2023). doi: 10.1109/MEMS49605.2023.10052290. Archive: Explore Bristol Research

Jo, G., Edinger, P., Bleiker, S. J., Wang, X., Yuji Takabayashi, A., Sattari, H., Quack, N., Jezzini, M., Su Lee, J., Kumar Malik, A., Verheyen, P., Zand, I., Khan, U., Bogaerts, W., Stemme, G., Gylfason, K. B. & Niklaus, F.

Wafer-level Hermetic Sealing of Silicon Photonic MEMS by Direct Metal-to-Metal Bonding.

in WaferBond’22 Conference of Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (2022). Archive: DIVA

Reynolds, J. D., Rana, S., Worsey, E., Tang, Q., Kulsreshath, M. K., Chong, H. M. H. & Pamunuwa, D.

Single‐Contact, Four‐Terminal Microelectromechanical Relay for Efficient Digital Logic.

Advanced Electronic Materials 2200584 (2022). doi: 10.1002/aelm.202200584. Archive: Explore Bristol Research

Ku, B., van de Wetering, F., Bolten, J., Stel, B., van de Kerkhof, M. A. & Lemme, M. C.

AFM‐Based Hamaker Constant Determination with Blind Tip Reconstruction.

Advanced Materials Technologies 2200411 (2022). doi: 10.1002/admt.202200411. Archive: arXiv

Jo, G., Edinger, P., Bleiker, S. J., Wang, X., Takabayashi, A. Y., Sattari, H., Quack, N., Jezzini, M., Lee, J. S., Verheyen, P., Zand, I., Khan, U., Bogaerts, W., Stemme, G., Gylfason, K. B. & Niklaus, F.

Wafer-level hermetically sealed silicon photonic MEMS.

Photonics Research 10, A14 (2022). doi: 10.1364/PRJ.441215. Archive: DIVA

Pamunuwa, D., Worsey, E., Reynolds, J. D., Seward, D., Chong, H. M. H. & Rana, S.

Theory, Design, and Characterization of Nanoelectromechanical Relays for Stiction-Based Non-Volatile Memory.

Journal of Microelectromechanical Systems 1–9 (2022). doi: 10.1109/JMEMS.2021.3138022. Archive: Explore Bristol Research

Jo, G., Edinger, P., Bleiker, S., Wang, X., Takabayashi, A. Y., Sattari, H., Quack, N., Jezzini de Anda, M. A., Verheyen, P., Stemme, G., Bogaerts, W., Gylfason, K. B. & Niklaus, F.

Wafer-level vacuum sealing for packaging of silicon photonic MEMS.

in Silicon Photonics XVI (Reed, G. T. & Knights, A. P.eds. ) 11 (SPIE, 2021). doi: 10.1117/12.2582975. Archive: DIVA

Participation at scientific events

IMAPS HiTEC, CICMT & Power Packaging 2023

Tuesday, April 18, 2023

IMAPS HiTEC, CICMT & Power Packaging 2023 Conference on high temperature electronics, 18-20 April 2023, Albuquerque, USA - presentation by Dinesh Pamunuwa (UNIVBRIS) "Edge Computing Platform based on Nanoelectromechanical Relays"

Link to the event LinkedIn post

Publishable summary

ZeroAMP produces annual publishable reports which describe the project achievements. They are public and the latest one can be downloaded by clicking on the link below.

First publishable summary

Project Video

A video presentation of the ZeroAMP project has been produced by SCIPROM at the beginning of the project. A very special thanks to ZeroAMP coordinator Piers Tramlett for a beautiful voiceover.

Project Flyer

Our flyer is a concise presentation of our overall project structure and goals. It is printer-friendly and can be easily read on a mobile device.

Download the flyer

This project has received funding from the European Union's Horizon 2020 research and innovation programme under grant agreement No 871740 (ZeroAMP).

Media kit

Members section

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