Researchers from the KTH team in ZeroAMP have developed a new approach to hermetically seal silicon photonic MEMS.
More specifically, they demonstrate wafer-level vacuum sealing of silicon photonic MEMS inside cavities with ultra thin caps featuring optical and electrical feedthroughs that connect the photonic MEMS on the inside to optical grating couplers and electrical bond pads on the outside.
The open-access publication is available here for download.
