Piers Tremlett, packaging and manufacturing engineer at MICROCHIP and coordinator of the ZeroAMP project, was glad to give an invited talk at the online workshop “Hybrid & Packaging Working Group Meeting # 51”, organised by the European Space Agency on 01 December 2021.
At this Space Microelectronics Packaging workshop, Piers Tremlett delivered a presentation about the products and services proposed by the MICROCHIP company, as well as an overview of the ZeroAMP goals and challenges.
