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Invited talk by MICROCHIP at the the European Space Agency

Piers Tremlett, packaging and manufacturing engineer at MICROCHIP and coordinator of the ZeroAMP project, was glad to give an invited talk at the online workshop “Hybrid & Packaging Working Group Meeting # 51”, organised by the European Space Agency on 01 December 2021.

At this Space Microelectronics Packaging workshop, Piers Tremlett delivered a presentation about the products and services proposed by the MICROCHIP company, as well as an overview of the ZeroAMP goals and challenges.

This project has received funding from the European Union's Horizon 2020 research and innovation programme under grant agreement No 871740 (ZeroAMP).
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