The KTH team was nicely represented by Gaehun Jo, PhD student involved in ZeroAMP, at the International Conference on Wafer Bonding – WaferBond’22 held in October 2022.
They have just published the conference paper which describes a new process developed to achieve wafer-level hermetic sealing of silicon (Si) photonic micro-electromechanical system (MEMS) inside cavities with ultra-thin Si caps. This novel packaging solution, which has been developed in synergies with other EU-funded projects, is a promising and versatile approach for novel integrated MEMS applications, such as integrated optical MEMS phase shifters, tunable couplers and switches.
The conference paper is available in open access, for download here.
This project has received funding from the European Union's Horizon 2020 research and innovation programme under grant agreement No 871740 (ZeroAMP).