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ZeroAMP at WaferBond '22 Conference

The International Conference on Wafer Bonding – WaferBond’22 will be held on 04-06 October 2022, in Schmalkalden, Germany. It will be hosted by Schmalkalden University of Applied Sciences.

The conference, with lectures, poster presentations and exhibitions of the sponsors, will cover all aspects of bonding wafers and comparable substrates from basic research to industrial applications.

Gaehun Jo, PhD student at KTH involved in the ZeroAMP project, will gladly give a presentation at WaferBond’22 entitled "Wafer-level Hermetic Sealing of Silicon Photonic MEMS by Direct Metal-to-Metal Bonding".

This project has received funding from the European Union's Horizon 2020 research and innovation programme under grant agreement No 871740 (ZeroAMP).
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