TY - CONF TI - Wafer-level vacuum sealing for packaging of silicon photonic MEMS AU - Jo, Gaehun AU - Edinger, Pierre AU - Bleiker, Simon AU - Wang, Xiaojing AU - Takabayashi, Alain Y. AU - Sattari, Hamed AU - Quack, Niels AU - Jezzini de Anda, Moises A. AU - Verheyen, Peter AU - Stemme, Göran AU - Bogaerts, Wim AU - Gylfason, Kristinn B. AU - Niklaus, Frank T2 - Silicon Photonics XVI A2 - Reed, Graham T. A2 - Knights, Andrew P. C1 - Online Only, United States C3 - Silicon Photonics XVI DA - 2021/03/05/ PY - 2021 DO - 10.1117/12.2582975 DP - DOI.org (Crossref) SP - 11 PB - SPIE SN - 978-1-5106-4217-1 978-1-5106-4218-8 UR - https://www.spiedigitallibrary.org/conference-proceedings-of-spie/11691/2582975/Wafer-level-vacuum-sealing-for-packaging-of-silicon-photonic-MEMS/10.1117/12.2582975.full AN - http://kth.diva-portal.org/smash/record.jsf?pid=diva2%3A1542824&dswid=-9605 DB - DIVA Y2 - 2021/05/05/09:58:24 ER -