@inproceedings{jo_wafer-level_2021,
	location = {Online Only, United States},
	title = {Wafer-level vacuum sealing for packaging of silicon photonic {MEMS}},
	isbn = {978-1-5106-4217-1 978-1-5106-4218-8},
	url = {https://www.spiedigitallibrary.org/conference-proceedings-of-spie/11691/2582975/Wafer-level-vacuum-sealing-for-packaging-of-silicon-photonic-MEMS/10.1117/12.2582975.full},
	doi = {10.1117/12.2582975},
	eventtitle = {Silicon Photonics {XVI}},
	pages = {11},
	booktitle = {Silicon Photonics {XVI}},
	publisher = {{SPIE}},
	author = {Jo, Gaehun and Edinger, Pierre and Bleiker, Simon and Wang, Xiaojing and Takabayashi, Alain Y. and Sattari, Hamed and Quack, Niels and Jezzini de Anda, Moises A. and Verheyen, Peter and Stemme, Göran and Bogaerts, Wim and Gylfason, Kristinn B. and Niklaus, Frank},
	editor = {Reed, Graham T. and Knights, Andrew P.},
	urldate = {2021-05-05},
	date = {2021-03-05},
}