@inproceedings{jo_wafer-level_2022,
	title = {Wafer-level Hermetic Sealing of Silicon Photonic {MEMS} by Direct Metal-to-Metal Bonding},
	abstract = {The field of silicon (Si) photonic micro-electromechanical system ({MEMS}) for photonic integrated circuits ({PICs}) has evolved rapidly. Thanks to the ultra-low power consumption of Si photonic {MEMS}, it enables a wide range of high-performance photonic devices such as integrated optical {MEMS} phase shifters, tunable couplers and switches. However, photonic {MEMS} have suspended and movable parts which need to be protected from environmental influences, such as exposure to dust and humidity. Therefore, a packaging solution is needed for reliable operation over long periods. Here, we demonstrate wafer-level vacuum sealing of Si photonic {MEMS} inside cavities with ultra-thin Si caps.},
	eventtitle = {{WaferBond}’22 Conference of Wafer Bonding for Microsystems, 3D- and Wafer Level Integration},
	booktitle = {{WaferBond}’22 Conference of Wafer Bonding for Microsystems, 3D- and Wafer Level Integration},
	author = {Jo, Gaehun and Edinger, Pierre and Bleiker, Simon J. and Wang, Xiaojing and Yuji Takabayashi, Alain and Sattari, Hamed and Quack, Niels and Jezzini, Moises and Su Lee, Jun and Kumar Malik, Arun and Verheyen, Peter and Zand, Iman and Khan, Umar and Bogaerts, Wim and Stemme, Göran and Gylfason, Kristinn B. and Niklaus, Frank},
	date = {2022-11-30},
}