TY  - CONF
TI  - Nanoelectromechanical analog-to-digital converter for low power and harsh environments
AU  - Worsey, Elliott
AU  - Tang, Qi
AU  - Krishnan, Manu Bala
AU  - Kumar Kulsreshath, Mukesh
AU  - Pamunuwa, Dinesh
T2  - 2024 IEEE International Symposium on Circuits and Systems (ISCAS)
C1  - Singapore, Singapore
C3  - 2024 IEEE International Symposium on Circuits and Systems (ISCAS)
DA  - 2024/05/19/
PY  - 2024
DO  - 10.1109/ISCAS58744.2024.10558630
DP  - DOI.org (Crossref)
SP  - 1
EP  - 5
PB  - IEEE
SN  - 979-8-3503-3099-1
UR  - https://ieeexplore.ieee.org/document/10558630/
AN  - https://hdl.handle.net/1983/c96a8061-4b45-4531-9660-4fcf06904f95
DB  - Explore Bristol Research
Y2  - 2024/07/11/16:43:41
ER  - 

TY  - JOUR
TI  - Digital Nanoelectromechanical Non-Volatile Memory Cell
AU  - Kulsreshath, Mukesh K.
AU  - Tang, Qi
AU  - Worsey, Elliott
AU  - Krishanan, Manu B.
AU  - Li, Yingying
AU  - Bleiker, Simon J.
AU  - Niklaus, Frank
AU  - Pamunuwa, Dinesh
T2  - IEEE Electron Device Letters
DA  - 2024/04//
PY  - 2024
DO  - 10.1109/LED.2024.3362956
DP  - DOI.org (Crossref)
VL  - 45
IS  - 4
SP  - 728
EP  - 731
J2  - IEEE Electron Device Lett.
SN  - 0741-3106, 1558-0563
UR  - https://ieeexplore.ieee.org/document/10423004/
AN  - https://hdl.handle.net/1983/933c48e1-c7ea-425d-9c2b-39b0967fcbcb
DB  - Explore Bristol Research
Y2  - 2024/06/27/10:10:37
ER  - 

TY  - THES
TI  - Nanoelectromechanical technology for radiation and temperature harsh environments
AU  - Worsey, Elliott
DA  - 2024/05/07/
PY  - 2024
PB  - university of Bristol
UR  - https://research-information.bris.ac.uk/en/studentTheses/nanoelectromechanical-technology-for-radiation-and-temperature-ha
AN  - https://research-information.bris.ac.uk/en/studentTheses/nanoelectromechanical-technology-for-radiation-and-temperature-ha
DB  - Explore Bristol Research
ER  - 

TY  - CONF
TI  - Design and Fabrication of a 4-Terminal In-Plane Nanoelectromechanical Relay
AU  - Li, Yingying
AU  - Bleiker, Simon J.
AU  - Edinger, Pierre
AU  - Worsey, Elliott
AU  - Kumar Kulsreshath, Alain
AU  - Tang, Qi
AU  - Yuji Takabayashi, Alain
AU  - Quack, Niels
AU  - Verheyen, Peter
AU  - Bogaerts, Wim
AU  - Gylfason, Kristinn B.
AU  - Pamunuwa, Dinesh
AU  - Niklaus, Frank
T2  - IEEE Transducers 2023 Conference on Solid-State Sensors, Actuators and Microsystems
C3  - IEEE Transducers 2023 Conference on Solid-State Sensors, Actuators and Microsystems
DA  - 2023/06/29/
PY  - 2023
SN  - 979-8-3503-3302-2
AN  - https://www.diva-portal.org/smash/record.jsf?dswid=-1530&pid=diva2%3A1810149&c=6&searchType=SIMPLE&language=en&query=yingying+li&af=%5B%22contentTypeCode%3Arefereed%22%5D&aq=%5B%5B%5D%5D&aq2=%5B%5B%5D%5D&aqe=%5B%5D&noOfRows=50&sortOrder=author_sort_asc&sortOrder2=title_sort_asc&onlyFullText=false&sf=all
DB  - DIVA
ER  - 

TY  - JOUR
TI  - Integrated 4-terminal single-contact nanoelectromechanical relays implemented in a silicon-on-insulator foundry process
AU  - Li, Yingying
AU  - Worsey, Elliott
AU  - Bleiker, Simon J.
AU  - Edinger, Pierre
AU  - Kulsreshath, Mukesh Kumar
AU  - Tang, Qi
AU  - Takabayashi, Alain Yuji
AU  - Quack, Niels
AU  - Verheyen, Peter
AU  - Bogaerts, Wim
AU  - Gylfason, Kristinn B.
AU  - Pamunuwa, Dinesh
AU  - Niklaus, Frank
T2  - Nanoscale
AB  - Silicon 4-T NEM relays, patterned in front-end-of-line processing and monolithically integrated with back-end-of-line metallic interconnects manufactured in a commercial foundry platform.
          , 
            Integrated nanoelectromechanical (NEM) relays can be used instead of transistors to implement ultra-low power logic circuits, due to their abrupt turn off characteristics and zero off-state leakage. Further, realizing circuits with 4-terminal (4-T) NEM relays enables significant reduction in circuit device count compared to conventional transistor circuits. For practical 4-T NEM circuits, however, the relays need to be miniaturized and integrated with high-density back-end-of-line (BEOL) interconnects, which is challenging and has not been realized to date. Here, we present electrostatically actuated silicon 4-T NEM relays that are integrated with multi-layer BEOL metal interconnects, implemented using a commercial silicon-on-insulator (SOI) foundry process. We demonstrate 4-T switching and the use of body-biasing to reduce pull-in voltage of a relay with a 300 nm airgap, from 15.8 V to 7.8 V, consistent with predictions of the finite-element model. Our 4-T NEM relay technology enables new possibilities for realizing NEM-based circuits for applications demanding harsh environment computation and zero standby power, in industries such as automotive, Internet-of-Things, and aerospace.
DA  - 2023/10/12/
PY  - 2023
DO  - 10.1039/D3NR03429A
DP  - DOI.org (Crossref)
SP  - 10.1039.D3NR03429A
J2  - Nanoscale
LA  - en
SN  - 2040-3364, 2040-3372
UR  - http://xlink.rsc.org/?DOI=D3NR03429A
AN  - https://www.diva-portal.org/smash/record.jsf?dswid=-1530&pid=diva2%3A1810174&c=4&searchType=SIMPLE&language=en&query=yingying+li&af=%5B%22contentTypeCode%3Arefereed%22%5D&aq=%5B%5B%5D%5D&aq2=%5B%5B%5D%5D&aqe=%5B%5D&noOfRows=50&sortOrder=author_sort_asc&sortOrder2=title_sort_asc&onlyFullText=false&sf=all
DB  - DIVA
Y2  - 2023/10/23/13:49:24
ER  - 

TY  - CONF
TI  - Fully Microelectromechanical Non-Volatile Memory Cell
AU  - Worsey, Elliott
AU  - Kulsreshath, Mukesh K.
AU  - Tang, Qi
AU  - Pamunuwa, Dinesh
T2  - 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)
C1  - Munich, Germany
C3  - 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)
DA  - 2023/01/15/
PY  - 2023
DO  - 10.1109/MEMS49605.2023.10052290
DP  - DOI.org (Crossref)
SP  - 507
EP  - 510
PB  - IEEE
SN  - 978-1-6654-9308-6
UR  - https://ieeexplore.ieee.org/document/10052290/
AN  - https://research-information.bris.ac.uk/en/publications/fully-microelectromechanical-non-volatile-memory-cell
DB  - Explore Bristol Research
Y2  - 2023/04/04/09:40:20
ER  - 

TY  - CONF
TI  - Wafer-level Hermetic Sealing of Silicon Photonic MEMS by Direct Metal-to-Metal Bonding
AU  - Jo, Gaehun
AU  - Edinger, Pierre
AU  - Bleiker, Simon J.
AU  - Wang, Xiaojing
AU  - Yuji Takabayashi, Alain
AU  - Sattari, Hamed
AU  - Quack, Niels
AU  - Jezzini, Moises
AU  - Su Lee, Jun
AU  - Kumar Malik, Arun
AU  - Verheyen, Peter
AU  - Zand, Iman
AU  - Khan, Umar
AU  - Bogaerts, Wim
AU  - Stemme, Göran
AU  - Gylfason, Kristinn B.
AU  - Niklaus, Frank
T2  - WaferBond’22 Conference of Wafer Bonding for Microsystems, 3D- and Wafer Level Integration
AB  - The field of silicon (Si) photonic micro-electromechanical system (MEMS) for photonic integrated circuits (PICs) has evolved rapidly. Thanks to the ultra-low power consumption of Si photonic MEMS, it enables a wide range of high-performance photonic devices such as integrated optical MEMS phase shifters, tunable couplers and switches. However, photonic MEMS have suspended and movable parts which need to be protected from environmental influences, such as exposure to dust and humidity. Therefore, a packaging solution is needed for reliable operation over long periods. Here, we demonstrate wafer-level vacuum sealing of Si photonic MEMS inside cavities with ultra-thin Si caps.
C3  - WaferBond’22 Conference of Wafer Bonding for Microsystems, 3D- and Wafer Level Integration
DA  - 2022/11/30/
PY  - 2022
AN  - http://kth.diva-portal.org/smash/record.jsf?pid=diva2%3A1714873&dswid=-8825
DB  - DIVA
ER  - 

TY  - JOUR
TI  - Single‐Contact, Four‐Terminal Microelectromechanical Relay for Efficient Digital Logic
AU  - Reynolds, James D.
AU  - Rana, Sunil
AU  - Worsey, Elliott
AU  - Tang, Qi
AU  - Kulsreshath, Mukesh K.
AU  - Chong, Harold M. H.
AU  - Pamunuwa, Dinesh
T2  - Advanced Electronic Materials
DA  - 2022/09/06/
PY  - 2022
DO  - 10.1002/aelm.202200584
DP  - DOI.org (Crossref)
SP  - 2200584
J2  - Adv Elect Materials
LA  - en
SN  - 2199-160X, 2199-160X
UR  - https://onlinelibrary.wiley.com/doi/10.1002/aelm.202200584
AN  - https://research-information.bris.ac.uk/en/publications/single-contact-four-terminal-microelectromechanical-relay-for-eff
DB  - Explore Bristol Research
Y2  - 2022/09/28/07:45:43
ER  - 

TY  - JOUR
TI  - AFM‐Based Hamaker Constant Determination with Blind Tip Reconstruction
AU  - Ku, Benny
AU  - van de Wetering, Ferdinandus
AU  - Bolten, Jens
AU  - Stel, Bart
AU  - van de Kerkhof, Mark A.
AU  - Lemme, Max C.
T2  - Advanced Materials Technologies
DA  - 2022/08/11/
PY  - 2022
DO  - 10.1002/admt.202200411
DP  - DOI.org (Crossref)
SP  - 2200411
J2  - Adv Materials Technologies
LA  - en
SN  - 2365-709X, 2365-709X
UR  - https://onlinelibrary.wiley.com/doi/10.1002/admt.202200411
AN  - https://arxiv.org/abs/2208.06822
DB  - arXiv
Y2  - 2022/08/17/14:18:56
ER  - 

TY  - JOUR
TI  - Wafer-level hermetically sealed silicon photonic MEMS
AU  - Jo, Gaehun
AU  - Edinger, Pierre
AU  - Bleiker, Simon J.
AU  - Wang, Xiaojing
AU  - Takabayashi, Alain Yuji
AU  - Sattari, Hamed
AU  - Quack, Niels
AU  - Jezzini, Moises
AU  - Lee, Jun Su
AU  - Verheyen, Peter
AU  - Zand, Iman
AU  - Khan, Umar
AU  - Bogaerts, Wim
AU  - Stemme, Göran
AU  - Gylfason, Kristinn B.
AU  - Niklaus, Frank
T2  - Photonics Research
DA  - 2022/02/01/
PY  - 2022
DO  - 10.1364/PRJ.441215
DP  - DOI.org (Crossref)
VL  - 10
IS  - 2
SP  - A14
J2  - Photon. Res.
LA  - en
SN  - 2327-9125
UR  - http://opg.optica.org/abstract.cfm?URI=prj-10-2-A14
AN  - http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-308964
DB  - DIVA
Y2  - 2022/01/19/14:08:17
ER  - 

TY  - JOUR
TI  - Theory, Design, and Characterization of Nanoelectromechanical Relays for Stiction-Based Non-Volatile Memory
AU  - Pamunuwa, Dinesh
AU  - Worsey, Elliott
AU  - Reynolds, Jamie D.
AU  - Seward, Derek
AU  - Chong, Harold M. H.
AU  - Rana, Sunil
T2  - Journal of Microelectromechanical Systems
DA  - 2022///
PY  - 2022
DO  - 10.1109/JMEMS.2021.3138022
DP  - DOI.org (Crossref)
SP  - 1
EP  - 9
J2  - J. Microelectromech. Syst.
SN  - 1057-7157, 1941-0158
UR  - https://ieeexplore.ieee.org/document/9669034/
AN  - https://research-information.bris.ac.uk/en/publications/theory-design-and-characterisation-of-nanoelectromechanical-relay
DB  - Explore Bristol Research
Y2  - 2022/01/07/08:56:46
ER  - 

TY  - CONF
TI  - Wafer-level vacuum sealing for packaging of silicon photonic MEMS
AU  - Jo, Gaehun
AU  - Edinger, Pierre
AU  - Bleiker, Simon
AU  - Wang, Xiaojing
AU  - Takabayashi, Alain Y.
AU  - Sattari, Hamed
AU  - Quack, Niels
AU  - Jezzini de Anda, Moises A.
AU  - Verheyen, Peter
AU  - Stemme, Göran
AU  - Bogaerts, Wim
AU  - Gylfason, Kristinn B.
AU  - Niklaus, Frank
T2  - Silicon Photonics XVI
A2  - Reed, Graham T.
A2  - Knights, Andrew P.
C1  - Online Only, United States
C3  - Silicon Photonics XVI
DA  - 2021/03/05/
PY  - 2021
DO  - 10.1117/12.2582975
DP  - DOI.org (Crossref)
SP  - 11
PB  - SPIE
SN  - 978-1-5106-4217-1 978-1-5106-4218-8
UR  - https://www.spiedigitallibrary.org/conference-proceedings-of-spie/11691/2582975/Wafer-level-vacuum-sealing-for-packaging-of-silicon-photonic-MEMS/10.1117/12.2582975.full
AN  - http://kth.diva-portal.org/smash/record.jsf?pid=diva2%3A1542824&dswid=-9605
DB  - DIVA
Y2  - 2021/05/05/09:58:24
ER  -