@inproceedings{worseyNanoelectromechanicalAnalogtodigitalConverter2024,
	location = {Singapore, Singapore},
	title = {Nanoelectromechanical analog-to-digital converter for low power and harsh environments},
	rights = {https://doi.org/10.15223/policy-029},
	isbn = {979-8-3503-3099-1},
	url = {https://ieeexplore.ieee.org/document/10558630/},
	doi = {10.1109/ISCAS58744.2024.10558630},
	eventtitle = {2024 {IEEE} International Symposium on Circuits and Systems ({ISCAS})},
	pages = {1--5},
	booktitle = {2024 {IEEE} International Symposium on Circuits and Systems ({ISCAS})},
	publisher = {{IEEE}},
	author = {Worsey, Elliott and Tang, Qi and Krishnan, Manu Bala and Kumar Kulsreshath, Mukesh and Pamunuwa, Dinesh},
	urldate = {2024-07-11},
	date = {2024-05-19},
}

@article{kulsreshathDigitalNanoelectromechanicalNonVolatile2024,
	title = {Digital Nanoelectromechanical Non-Volatile Memory Cell},
	volume = {45},
	rights = {https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/{IEEE}.html},
	issn = {0741-3106, 1558-0563},
	url = {https://ieeexplore.ieee.org/document/10423004/},
	doi = {10.1109/LED.2024.3362956},
	pages = {728--731},
	number = {4},
	journaltitle = {{IEEE} Electron Device Letters},
	shortjournal = {{IEEE} Electron Device Lett.},
	author = {Kulsreshath, Mukesh K. and Tang, Qi and Worsey, Elliott and Krishanan, Manu B. and Li, Yingying and Bleiker, Simon J. and Niklaus, Frank and Pamunuwa, Dinesh},
	urldate = {2024-06-27},
	date = {2024-04},
}

@thesis{worseyNanoelectromechanicalTechnologyRadiation2024,
	title = {Nanoelectromechanical technology for radiation and temperature harsh environments},
	url = {https://research-information.bris.ac.uk/en/studentTheses/nanoelectromechanical-technology-for-radiation-and-temperature-ha},
	institution = {university of Bristol},
	type = {phdthesis},
	author = {Worsey, Elliott},
	date = {2024-05-07},
}

@inproceedings{liDesignFabrication4Terminal2023,
	title = {Design and Fabrication of a 4-Terminal In-Plane Nanoelectromechanical Relay},
	isbn = {979-8-3503-3302-2},
	eventtitle = {{IEEE} Transducers 2023 Conference on Solid-State Sensors, Actuators and Microsystems},
	booktitle = {{IEEE} Transducers 2023 Conference on Solid-State Sensors, Actuators and Microsystems},
	author = {Li, Yingying and Bleiker, Simon J. and Edinger, Pierre and Worsey, Elliott and Kumar Kulsreshath, Alain and Tang, Qi and Yuji Takabayashi, Alain and Quack, Niels and Verheyen, Peter and Bogaerts, Wim and Gylfason, Kristinn B. and Pamunuwa, Dinesh and Niklaus, Frank},
	date = {2023-06-29},
}

@article{liIntegrated4terminalSinglecontact2023,
	title = {Integrated 4-terminal single-contact nanoelectromechanical relays implemented in a silicon-on-insulator foundry process},
	issn = {2040-3364, 2040-3372},
	url = {http://xlink.rsc.org/?DOI=D3NR03429A},
	doi = {10.1039/D3NR03429A},
	abstract = {Silicon 4-T {NEM} relays, patterned in front-end-of-line processing and monolithically integrated with back-end-of-line metallic interconnects manufactured in a commercial foundry platform.
          , 
            Integrated nanoelectromechanical ({NEM}) relays can be used instead of transistors to implement ultra-low power logic circuits, due to their abrupt turn off characteristics and zero off-state leakage. Further, realizing circuits with 4-terminal (4-T) {NEM} relays enables significant reduction in circuit device count compared to conventional transistor circuits. For practical 4-T {NEM} circuits, however, the relays need to be miniaturized and integrated with high-density back-end-of-line ({BEOL}) interconnects, which is challenging and has not been realized to date. Here, we present electrostatically actuated silicon 4-T {NEM} relays that are integrated with multi-layer {BEOL} metal interconnects, implemented using a commercial silicon-on-insulator ({SOI}) foundry process. We demonstrate 4-T switching and the use of body-biasing to reduce pull-in voltage of a relay with a 300 nm airgap, from 15.8 V to 7.8 V, consistent with predictions of the finite-element model. Our 4-T {NEM} relay technology enables new possibilities for realizing {NEM}-based circuits for applications demanding harsh environment computation and zero standby power, in industries such as automotive, Internet-of-Things, and aerospace.},
	pages = {10.1039.D3NR03429A},
	journaltitle = {Nanoscale},
	shortjournal = {Nanoscale},
	author = {Li, Yingying and Worsey, Elliott and Bleiker, Simon J. and Edinger, Pierre and Kulsreshath, Mukesh Kumar and Tang, Qi and Takabayashi, Alain Yuji and Quack, Niels and Verheyen, Peter and Bogaerts, Wim and Gylfason, Kristinn B. and Pamunuwa, Dinesh and Niklaus, Frank},
	urldate = {2023-10-23},
	date = {2023-10-12},
	langid = {english},
}

@inproceedings{worseyFullyMicroelectromechanicalNonVolatile2023,
	location = {Munich, Germany},
	title = {Fully Microelectromechanical Non-Volatile Memory Cell},
	isbn = {978-1-6654-9308-6},
	url = {https://ieeexplore.ieee.org/document/10052290/},
	doi = {10.1109/MEMS49605.2023.10052290},
	eventtitle = {2023 {IEEE} 36th International Conference on Micro Electro Mechanical Systems ({MEMS})},
	pages = {507--510},
	booktitle = {2023 {IEEE} 36th International Conference on Micro Electro Mechanical Systems ({MEMS})},
	publisher = {{IEEE}},
	author = {Worsey, Elliott and Kulsreshath, Mukesh K. and Tang, Qi and Pamunuwa, Dinesh},
	urldate = {2023-04-04},
	date = {2023-01-15},
}

@inproceedings{joWaferlevelHermeticSealing2022,
	title = {Wafer-level Hermetic Sealing of Silicon Photonic {MEMS} by Direct Metal-to-Metal Bonding},
	abstract = {The field of silicon (Si) photonic micro-electromechanical system ({MEMS}) for photonic integrated circuits ({PICs}) has evolved rapidly. Thanks to the ultra-low power consumption of Si photonic {MEMS}, it enables a wide range of high-performance photonic devices such as integrated optical {MEMS} phase shifters, tunable couplers and switches. However, photonic {MEMS} have suspended and movable parts which need to be protected from environmental influences, such as exposure to dust and humidity. Therefore, a packaging solution is needed for reliable operation over long periods. Here, we demonstrate wafer-level vacuum sealing of Si photonic {MEMS} inside cavities with ultra-thin Si caps.},
	eventtitle = {{WaferBond}’22 Conference of Wafer Bonding for Microsystems, 3D- and Wafer Level Integration},
	booktitle = {{WaferBond}’22 Conference of Wafer Bonding for Microsystems, 3D- and Wafer Level Integration},
	author = {Jo, Gaehun and Edinger, Pierre and Bleiker, Simon J. and Wang, Xiaojing and Yuji Takabayashi, Alain and Sattari, Hamed and Quack, Niels and Jezzini, Moises and Su Lee, Jun and Kumar Malik, Arun and Verheyen, Peter and Zand, Iman and Khan, Umar and Bogaerts, Wim and Stemme, Göran and Gylfason, Kristinn B. and Niklaus, Frank},
	date = {2022-11-30},
}

@article{reynoldsSingleContactFour2022,
	title = {Single‐Contact, Four‐Terminal Microelectromechanical Relay for Efficient Digital Logic},
	issn = {2199-160X, 2199-160X},
	url = {https://onlinelibrary.wiley.com/doi/10.1002/aelm.202200584},
	doi = {10.1002/aelm.202200584},
	pages = {2200584},
	journaltitle = {Advanced Electronic Materials},
	shortjournal = {Adv Elect Materials},
	author = {Reynolds, James D. and Rana, Sunil and Worsey, Elliott and Tang, Qi and Kulsreshath, Mukesh K. and Chong, Harold M. H. and Pamunuwa, Dinesh},
	urldate = {2022-09-28},
	date = {2022-09-06},
	langid = {english},
}

@article{kuAFMBasedHamaker2022,
	title = {{AFM}‐Based Hamaker Constant Determination with Blind Tip Reconstruction},
	issn = {2365-709X, 2365-709X},
	url = {https://onlinelibrary.wiley.com/doi/10.1002/admt.202200411},
	doi = {10.1002/admt.202200411},
	pages = {2200411},
	journaltitle = {Advanced Materials Technologies},
	shortjournal = {Adv Materials Technologies},
	eprinttype = {arxiv},
	eprint = {https://arxiv.org/abs/2208.06822},
	author = {Ku, Benny and van de Wetering, Ferdinandus and Bolten, Jens and Stel, Bart and van de Kerkhof, Mark A. and Lemme, Max C.},
	urldate = {2022-08-17},
	date = {2022-08-11},
	langid = {english},
}

@article{joWaferlevelHermeticallySealed2022,
	title = {Wafer-level hermetically sealed silicon photonic {MEMS}},
	volume = {10},
	issn = {2327-9125},
	url = {http://opg.optica.org/abstract.cfm?URI=prj-10-2-A14},
	doi = {10.1364/PRJ.441215},
	pages = {A14},
	number = {2},
	journaltitle = {Photonics Research},
	shortjournal = {Photon. Res.},
	author = {Jo, Gaehun and Edinger, Pierre and Bleiker, Simon J. and Wang, Xiaojing and Takabayashi, Alain Yuji and Sattari, Hamed and Quack, Niels and Jezzini, Moises and Lee, Jun Su and Verheyen, Peter and Zand, Iman and Khan, Umar and Bogaerts, Wim and Stemme, Göran and Gylfason, Kristinn B. and Niklaus, Frank},
	urldate = {2022-01-19},
	date = {2022-02-01},
	langid = {english},
}

@article{pamunuwaTheoryDesignCharacterization2022,
	title = {Theory, Design, and Characterization of Nanoelectromechanical Relays for Stiction-Based Non-Volatile Memory},
	issn = {1057-7157, 1941-0158},
	url = {https://ieeexplore.ieee.org/document/9669034/},
	doi = {10.1109/JMEMS.2021.3138022},
	pages = {1--9},
	journaltitle = {Journal of Microelectromechanical Systems},
	shortjournal = {J. Microelectromech. Syst.},
	author = {Pamunuwa, Dinesh and Worsey, Elliott and Reynolds, Jamie D. and Seward, Derek and Chong, Harold M. H. and Rana, Sunil},
	urldate = {2022-01-07},
	date = {2022},
}

@inproceedings{joWaferlevelVacuumSealing2021a,
	location = {Online Only, United States},
	title = {Wafer-level vacuum sealing for packaging of silicon photonic {MEMS}},
	isbn = {978-1-5106-4217-1 978-1-5106-4218-8},
	url = {https://www.spiedigitallibrary.org/conference-proceedings-of-spie/11691/2582975/Wafer-level-vacuum-sealing-for-packaging-of-silicon-photonic-MEMS/10.1117/12.2582975.full},
	doi = {10.1117/12.2582975},
	eventtitle = {Silicon Photonics {XVI}},
	pages = {11},
	booktitle = {Silicon Photonics {XVI}},
	publisher = {{SPIE}},
	author = {Jo, Gaehun and Edinger, Pierre and Bleiker, Simon and Wang, Xiaojing and Takabayashi, Alain Y. and Sattari, Hamed and Quack, Niels and Jezzini de Anda, Moises A. and Verheyen, Peter and Stemme, Göran and Bogaerts, Wim and Gylfason, Kristinn B. and Niklaus, Frank},
	editor = {Reed, Graham T. and Knights, Andrew P.},
	urldate = {2021-05-05},
	date = {2021-03-05},
}